Publications | 材料機能信頼性設計分野　鈴木（研）研究室

2024

REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER

Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, Hideo Miura

12th International Conference on Electronics Materials and Packaging 131-136 2010年10月25日査読有り

Stress-Induced Acceleration of the Growth of δ-Phase Precipitates in Ni-Based Superalloy GH4169 (IN718) and Its Effect on the Acceleration of Intergranular Cracking Under Creep Loading at Elevated Temperature

Ayumi Nakayama, Run Zi Wang, Ken Suzuki, Hideo Miura

Minerals, Metals and Materials Series 369-378 2024年

Creep damage evolution by cavity nucleation and growth considering the cavity closure under cyclic loading conditions

Le Xu, Lv Yi Cheng, Kai Shang Li, Ken Suzuki, Hideo Miura, Run Zi Wang

Fatigue and Fracture of Engineering Materials and Structures 2024年

2023

The uniaxial zero thermal expansion and zero linear compressibility in distorted Prussian blue analogue RbCuCo(CN)<inf>6</inf>

Lei Wang, Ya Ning Sun, Xian Deng Wei, Meng Yin, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang

Physical Chemistry Chemical Physics 25(48) 32845-32852 2023年11月21日

Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation

Lv Yi Cheng, Run Zi Wang, Kai Shang Li, Hai Long Guo, Le Xu, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu

International Journal of Fatigue 175 2023年10月

Microstructural evolutions and life evaluation of non-proportional creep-fatigue considering loading path and holding position effects

Le Xu, Run Zi Wang, Yu Chen Wang, Lei He, Takamoto Itoh, Ken Suzuki, Hideo Miura, Xian Cheng Zhang

Materials Characterization 204 2023年10月

Acceleration mechanism of the degradation of the lifetime of Ni-based superalloys under creep-fatigue loading at elevated temperatures

Yifan Luo, Yukako Takahashi, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura

Fatigue and Fracture of Engineering Materials and Structures 46(8) 3043-3059 2023年8月

Oxidation-involved life prediction and damage assessment under generalized creep-fatigue loading conditions based on engineering damage mechanics

Run Zi Wang, Xian Cheng Zhang, Hang Hang Gu, Kai Shang Li, Jian Feng Wen, Hideo Miura, Ken Suzuki, Shan Tung Tu

Journal of Materials Research and Technology 23 114-130 2023年3月1日

Control of the Adsorption Behavior of Gas Molecule on Graphene by Strain: First-Principles Calculations for Development of Multi-Gas Selective Sensors

Meng Yin, Xiangyu Qiao, Ken Suzuki, Hideo Miura, Lei Wang

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 241-244 2023年

IMPROVEMENT OF SENSITIVITY AND SELECTIVITY OF GRAPHENE-BASED GAS SENSOR BY STRAIN

Xiangyu Qiao, Meng Yin, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 4 2023年

SENSITIVITY IMPROVEMENT OF GRAPHENE-BASED GAS SENSORS BY DIRECT GROWTH OF CARBON NANOTUBES ON THE GRAPHENE

Ken Suzuki, Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 4 2023年

Evaluation of fatigue and creep-fatigue damage levels on the basis of engineering damage mechanics approach

Li Sun, Xian Cheng Zhang, Run Zi Wang, Xiao Wei Wang, Shan Tung Tu, Ken Suzuki, Hideo Miura

International Journal of Fatigue 166 2023年1月

Strain-Induced Change of Gas Adsorption Properties of Graphene and its Application to a Gas Sensor

Xiangyu Qiao, Meng Yin, Ken Suzuki, Hideo Miura

2023 International Conference on Electronics Packaging, ICEP 2023 161-162 2023年

2022

Penta-graphene and phagraphene: thermal expansion, linear compressibility, and Poisson’s ratio

Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang

Journal of Physics Condensed Matter 34(50) 2022年12月14日

Tunable uniaxial, area, and volume negative thermal expansion in quartz-like and diamond-like metal–organic frameworks

Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang

RSC Advances, 12(34) 21770-21779 2022年8月査読有り

Evaluation of fracture properties of annealed Fe–Si–B–Cr amorphous alloys using micro-tensile tests and blanking machinability

Chieko Kuji, Masayoshi Mizutani, Keita Shimada, Ken Suzuki, Hideo Miura, Tsunemoto Kuriyagawa

Materials Science and Engineering: A 848 143483-143483 2022年7月

Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures

Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura

2022 International Conference on Electronics Packaging, ICEP 2022 81-82 2022年

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Shogo Tezuka, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022年

PREDICTION OF THE GENERATION OF INTERGRANULAR CRACKING IN STAINLESS STEELS UNDER CREEP LOADING AT ELEVATED TEMPERATURES

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022年

STRAIN-INDUCED CHANGE OF ADSORPTION BEHAVIOUR OF GAS MOLECULES ON GRAPHENE ANALYZED BY DENSITY FUNCTIONAL METHOD

Meng Yin, Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki, Lei Wang

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022年

IMPROVEMENT OF THE SENSITIVITY AND SELECTIVITY OF GAS MOLECULES OF GRAPHENE-BASE GAS SENSOR WITH CARBON NANOTUBES UNDER THE APPLICATION OF STRAIN

Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022年

CREEP-FATIGUE RELIABILITY ANALYSIS INTEGRATED WITH SURROGATE MODELLING: APPLICATION ON INDUSTRIAL CASE STUDIES

Run Zi Wang, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022年

2021

Stability and Thermodynamics Properties of CrFeNiCoMn/Pd High Entropy Alloys from First Principles

Nguyen Dung Tran, Arkapol Saengdeejing, Ken Suzuki, Hideo Miura, Ying Chen

Journal of Phase Equilibria and Diffusion 42(5) 606-616 2021年10月

Theoretical study on strain-controllable gradient Schottky barrier of dumbbell-shape graphene nanoribbon for highly sensitive strain sensors

Qinqiang Zhang, Ken Suzuki, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2021-September 171-174 2021年9月27日

Development of highly sensitive strain sensor using area-arrayed graphene nanoribbons

Ken Suzuki, Ryohei Nakagawa, Qinqiang Zhang, Hideo Miura

Nanomaterials 11(7) 2021年7月

Electronic band-engineering of a dumbbell-shaped graphene nanoribbon by the application of uniaxial tensile strain

Jowesh Avisheik Goundar, Qinqiang Zhang, Ken Suzuki, Hideo Miura

2021 International Conference on Electronics Packaging, ICEP 2021 147-148 2021年5月12日

CREEP-FATIGUE DAMAGE OF HEAT-RESISTANT ALLOYS CAUSED BY THE LOCAL LATTICE MISMATCH-INDUCED ACCELERATION OF THE GENERATION AND ACCUMULATION OF DISLOCATIONS AND VACANCIES

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

DETACHABLE FINE BUMP CONNECTION USING MULTI-WALLED CARBON-NANOTUBE BUNDLES FOR 3D SEMICONDUCTOR MODULES

Masasuke Kobayashi, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

EFFECT OF TENSILE STRAIN ON ELECTRON TRANSPORT PROPERTIES OF DUMBBELL-SHAPE GRAPHENE NANORIBBONS WITH METALLIC-SEMICONDUCTING INTERFACES

Ken Suzuki, Qinqiang Zhang, Xiangyu Qiao

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

ACCELERATION MECHANISM OF INTERGRANULAR CRACKING OF SUS361L UNDER CREEP-FATIGUE LOADING AT ELEVATED TEMPERATURES

Yukako Takahashi, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

IMPROVEMENT IN PHOTOSENSITIVITY OF DUMBBELL-SHAPED GRAPHENE NANORIBBON STRUCTURES BY USING ASYMMETRIC METALLIZATION TECHNIQUE

Jowesh Avisheik Goundar, Qiao Xiangyu, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

MOLECULAR DYNAMICS ANALYSIS OF THE ACCELERATION OF THE DEGRADATION OF THE STRENGTH OF A GRAIN BOUNDARY UNDER CREEP-FATIGUE LOADS

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021年

Stability and structural properties of vacancy-ordered and -disordered ZrC_x

Theresa Davey, Ken Suzuki, Hideo Miura, Ying Chen

RSC Advances 11(52) 32573-32589 2021年

2020

A first-principles study on the strain-induced localized electronic properties of dumbbell-shape graphene nanoribbon for highly sensitive strain sensors

Qinqiang Zhang, Ken Suzuki, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2020-September 379-382 2020年9月23日

A quasi in-situ study on the deformation mechanism in a 2.2Cr heat resistant steel

L. Cheng, Y. L. Chen, X. F. Gu, W. Yu, Q. W. Cai, K. Suzuki, H. Miura, R. D.K. Misra

Materials Science and Engineering A 788 2020年6月24日

Initial Intergranular Cracking of Ni-Base Superalloys Due to the Degradation of the Crystallinity of Grain Boundaries Under Creep-Fatigue Loading

Wataru Suzuki, Yifan Luo, Kenta Ishihara, Kens Suzuki, Hideo Miura

Structural Integrity 16 325-331 2020年

Theoretical study of heterojunction-like electronic properties between a semiconductive graphene nanoribbon and a metallic graphene for highly sensitive strain sensors

Qinqiang Zhang, Xiangyu Qiao, Masasuke Kobayashi, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 13 2020年

Non-destructive evaluation of the degradation of NI-base superalloy in the air by reflectance spectrum analysis

Shin Kasama, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2020年

Crystallinity dependence of grain and grain boundary strength of a bicrystal structure of copper

Ken Suzuki, Yiqing Fan, Yifan Luo

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 13 2020年

Development of a strain-controlled graphene-based highly sensitive gas sensor

Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 3 2020年

Molecular dynamics analysis of the acceleration of intergranular cracking of Ni-base superalloy caused by accumulation of vacancies and dislocations around grain boundaries

Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2020年

2019

Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections

Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月

Theoretical study of the edge effect of dumbbellshape graphene nanoribbon with a dual electronic properties by first-principle calculations

Qinqiang Zhang, Takuya Kudo, Jowesh Gounder, Ying Chen, Ken Suzuki, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019-September 2019年9月

Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections

Ryota Mizuno, Yutaro Nakoshi, Ken Suzuki, Hideo Miura

EMAP 2018 – 2018 20th International Conference on Electronic Materials and Packaging 2019年3月5日

Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons

Takuya Kudo, Zhi Wang, Ken Suzuki, Hideo Miura

EMAP 2018 – 2018 20th International Conference on Electronic Materials and Packaging 2019年3月5日

Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon

Qinqiang Zhang, Ken Suzuki, Hideo Miura

EMAP 2018 – 2018 20th International Conference on Electronic Materials and Packaging 2019年3月5日

A theoretical study of the effect of strain on the electronic structure of dumbbell-shape graphene nanoribbons

Qinqiang Zhang, Takuya Kudo, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 161-164 2019年1月24日

Variation of the strength and fracture mode of a grain and a grain boundary in polycrystalline copper thin films

Guoxiong Zheng, Yifan Luo, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 119-122 2019年1月24日

Development of 2D-graphene-based highly sensitive flexible strain sensor using fine columnar concentration structures

Zhi Wang, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 157-160 2019年1月24日

Strain and photovoltaic sensitivities of dumbbell-shape GnR-base sensors

Jowesh Avisheik Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019年

Change of the effective strength of grain boundaries in Alloy 617 under creep-fatigue loadings at 800°C

Wataru Suzuki, Kenta Ishihara, Ryo Kikuchi, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2019年

First principle analysis of the effect of strain on electronic transport properties of dumbbell-shape graphene nanoribbons

Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019年

Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors

Ryota Mizuno, Genta Nakauchi, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019年

Grain boundary cracking of nickel-based alloy 625 under creep loadings at elevated temperatures

Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2019年

Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading

Wataru Suzuki, Akari Sawase, Ken Suzuki, Hideo Miura

Structural Integrity 5 227-232 2019年

Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging

Yutaro Nakoshi, Ken Suzuki, Hideo Miura

Japanese Journal of Applied Physics 58(SB) 2019年

2018

Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films

Ken Suzuki, Fan Yiqing, Yifan Luo, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2018-September 88-91 2018年11月28日

Effect of tungsten on microstructures of annealed electrodeposited Ni-W alloy and its corrosion resistance

Lv Jinlong, Wang Zhuqing, Liang Tongxiang, Ken Suzuki, Miura Hideo

Surface and Coatings Technology 337 516-524 2018年3月15日査読有り

Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test

Guoxiong Zheng, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 179-182 2018年1月12日査読有り

Flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes

Ryusaku Osada, Kanji Yumoto, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 218-221 2018年1月12日査読有り

Graphene nano-ribbon-base highly sensitive pressure sensor using area-arrayed pillar structure

Zhi Wang, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 46-49 2018年1月12日査読有り

Relationship between mechanical properties and micro texture of electroplated gold thin films

Yutaro Nakoshi, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 58-61 2018年1月12日査読有り

Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices

Ryota Mizuno, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 62-65 2018年1月12日査読有り

Development of high-quality graphene nano-ribbon fabrication process for high sensitivity strain sensor

Ryohei Nakagawa, Ken Suzuki, Hideo Miura

Proceedings of Technical Papers – International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 214-217 2018年1月12日査読有り

Disappearance of martensitic strengthened-micro-texture in modified 9Cr-1Mo steel caused by stress-induced acceleration of atomic diffusion at elevated temperatures

Taichi Shinozaki, Ken Suzuki, Hideo Miura

Key Engineering Materials 774 KEM 31-35 2018年

Theoretical study of electronic band structure of dumbbellshape graphene nanoribbons for highly-sensitive strain sensors

Qinqiang Zhang, Takuya Kudo, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018年

Area-arrayed graphene nano-ribbon-base strain sensor

Ryohei Nakagawa, Zhi Wang, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018年

Photosensitivity of monolayer graphene-base field effect transistor

Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018年

Development of a flexible tactile sensor using area-arrayed bundle structures of multi-walled carbon nanotubes

Ryusaku Osada, Ken Suzuki

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018年

2017

Comparison of corrosion resistance of electrodeposited pure Ni and nanocrystalline Ni-Fe alloy in borate buffer solution

Lv Jinlong, Meng Yang, Ken Suzuki, Hideo Miura, Yubo Zhang

MATERIALS CHEMISTRY AND PHYSICS 202 15-21 2017年12月査読有り

Comparing different microstructures of CoS formed on bare Ni foam and Ni foam coated graphene and their supercapacitors performance

Lv Jinlong, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura

COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 529 57-63 2017年9月査読有り

Improving hydrogen evolution reaction for MoS2 hollow spheres

Lv Jinlong, Guo Wenli, Liang Tongxiang, Suzuki Ken, Miura Hideo

JOURNAL OF ELECTROANALYTICAL CHEMISTRY 799 304-307 2017年8月査読有り

The effect of graphene coated nickel foam on the microstructures of NiO and their supercapacitor performance

Lv Jinlong, Zhuqing Wang, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura

JOURNAL OF ELECTROANALYTICAL CHEMISTRY 799 595-601 2017年8月査読有り

Performance comparison of NiCo2O4 and NiCo2S4 formed on Ni foam for supercapacitor

Lv Jinlong, Liang Tongxiang, Yang Meng, Suzuki Ken, Miura Hideo

COMPOSITES PART B-ENGINEERING 123 28-33 2017年8月査読有り

The effect of reduced graphene oxide on MoS2 for the hydrogen evolution reaction in acidic solution

Lv Jinlong, Yang Meng, Liang Tongxiang, Ken Suzuki, Hideo Miura

CHEMICAL PHYSICS LETTERS 678 212-215 2017年6月査読有り

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

JOURNAL OF ELECTRONIC PACKAGING 139(2) 2017年6月査読有り

Fabrication of 3D graphene foam for a highly conducting electrode

Lv Jinlong, Yang Meng, Ken Suzuki, Hideo Miura

MATERIALS LETTERS 196 369-372 2017年6月査読有り

Investigation of microstructures of ZnCo2O4 on bare Ni foam and Ni foam coated with graphene and their supercapacitors performance

Jinlong Lv, Tongxiang Liang, Meng Yang, Suzuki Ken, Miura Hideo

JOURNAL OF ENERGY CHEMISTRY 26(3) 330-335 2017年5月査読有り

Synthesis of CoMoO4@RGO nanocomposites as high-performance supercapacitor electrodes

Lv Jinlong, Yang Meng, Ken Suzuki, Hideo Miura

MICROPOROUS AND MESOPOROUS MATERIALS 242 264-270 2017年4月査読有り

The plume-like Ni3S2 supercapacitor electrodes formed on nickel foam by catalysis of thermal reduced graphene oxide

Lv Jinlong, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura

JOURNAL OF ELECTROANALYTICAL CHEMISTRY 786 8-13 2017年2月査読有り

Atomic scale degradation of the initial strengthened micro texture of heat-resistant alloys under creep and fatigue loadings

Takuya Murakoshi, Taichi Shinozaki, Ken Suzuki, Hideo Miura

ICF 2017 – 14th International Conference on Fracture 1 409-411 2017年

Degradation of the strength of grains and grain boundaries of Ni-base superalloy under creep and creep-fatigue loadings

Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki, Hideo Miura

Key Engineering Materials 754 31-34 2017年査読有り

Mechanical stress monitoring sensor for 3-d module during manufacturing and operation

Koki Isobe, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70323 2017年査読有り

Creep-damage-induced deterioration of the strength of ni-base superalloy due to the change of its microstructure

Hayato Sakamoto, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70317 2017年査読有り

Largely deformable and highly sensitive strain sensor using carbon nanomaterials

Kanji Yumoto, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70388 2017年査読有り

Evaluation of damage evolution in nickel-base heat-resistant alloy under creep-fatigue loading conditions

Ken Suzuki, Takuya Murakoshi, Hiroki Sasaki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-72139 2017年査読有り

Crystallinity-induced variation of the yield strength of electroplated copper thin films

Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70302 2017年査読有り

CRYSTALLINITY CONTROL OF ELECTROPLATED INTERCONNECTIONS FOR IMPROVING THEIR STABILITY AND LIFETIME

Jiatong Liu, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017年査読有り

CRYSTALLINITY-INDUCED DEGRADATION OF THE LIFETIME OF ADVANCED INTERCONNECTIONS

Takeru Kato, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017年査読有り

Stress-induced acceleration of the change of microstructure of ni-base superalloy CM247LC

Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70314 2017年査読有り

MICROSCOPIC ANALYSIS OF THE INITIATION OF HIGH-TEMPERATURE DAMAGE OF NI-BASED HEAT-RESISTANT ALLOY

Takuya Murakoshi, Ken Suzuki, Isamu Nonaka, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017年査読有り

ATOMIC DIFFUSION INDUCED DAMAGE OF NI-BASE SUPER ALLOY AT ELEVATED TEMPERATURE

Motoki Takahashi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017年査読有り

Stress-induced change of the microstructure and strength of modified 9Cr-1Mo steel under fatigue and creep loadings at elevated temperatures

Taichi Shinozaki, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70494 2017年査読有り

Enhancing the corrosion resistance of the 2205 duplex stainless steel bipolar plates in PEMFCs environment by surface enriched molybdenum

Lv Jinlong, Wang Zhuqing, Liang Tongxiang, Suzuki Ken, Miura Hideo

RESULTS IN PHYSICS 7 3459-3464 2017年査読有り

VARIATION OF THE STRENGTH OF GRAINS AND GRAIN BOUNDARIES CAUSED BY THE FLUCTUATION OF THEIR CRYSTALLINITY

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017年査読有り

HIGHLY-SENSITIVE GRAPHENE NANO-RIBBON-BASE STRAIN SENSOR

Shinichirou Sasaki, Meng Yang, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017年査読有り

2016

Measurement of the strength of a grain boundary in electroplated copper thin-film interconnections by using micro tensile-test

T. Shinozaki, T Nakanishi, K Suzuki, H Miura

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2016- 2016年11月28日査読有り

Effects of uniaxial compressive strain on the electronic-transport properties of zigzag carbon nanotubes

Masato Ohnishi, Ken Suzuki, Hideo Miura

NANO RESEARCH 9(5) 1267-1275 2016年5月査読有り

Electronic properties and strain sensitivity of CVD-grown graphene with acetylene

Meng Yang, Shinichirou Sasaki, Masato Ohnishi, Ken Suzuki, Hideo Miura

JAPANESE JOURNAL OF APPLIED PHYSICS 55(4) 2016年4月査読有り

Control of the nucleation and quality of graphene grown by low-pressure chemical vapor deposition with acetylene

Meng Yang, Shinichirou Sasaki, Ken Suzuki, Hideo Miura

APPLIED SURFACE SCIENCE 366 219-226 2016年3月査読有り

Minimization of Residual Stress in TSV Interconnections by Controlling Their Crystallinity

Jiatong Liu, Takeru Kato, Ken Suzuki, Hideo Miura

2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) 58-63 2016年査読有り

HIGHLY SENSITIVE PRESSURE SENSOR USING TWO-DIMENSIONALLY ALIGNED CARBON NANOTUBE BUNDLES

Takuya Nozaki, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 10 2016年査読有り

CHARACTERIZATION OF THE ELECTRONIC PROPERTIES AND STRAIN SENSITIVITY OF GRAPHENE FORMED BY C2H2 CHEMICAL VAPOR DEPOSITION

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 10 2016年査読有り

Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

Hayato Sakamoto, Takeru Kato, Ken Suzuki, Hideo Miura

2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE 2016年査読有り

Development of MWCNT-based Strain Sensor Using Flexible Substrate

Kanji Yumoto, Ken Suzuki, Hideo Miura

2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE 2016年査読有り

Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries

Takuya Murakoshi, Taichi Shinozaki, Ken Suzuki, Hideo Miura

21ST EUROPEAN CONFERENCE ON FRACTURE, (ECF21) 2 1383-1390 2016年査読有り

CRYSTALLINITY DEGRADATION CAUSED BY ALLOYING ELEMENTS DIFFUSION DURING CREEP OF NI-BASE SUPERALLOY

Ken Suzuki, Takuya Murakoshi, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL. 14 2016年査読有り

ELUCIDATION OF THE HIGH CYCLE FATIGUE DAMAGE MECHANISM OF MODIFIED 9CR-1MO STEEL AT ELEVATED TEMPERATURE

Takuya Murakoshi, Motoyuki Ochi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 9 2016年査読有り

Highly-sensitive graphene nano-ribbon-base strain sensor

Shinichirou Sasaki, Yang Meng, Ken Suzuki, Hideo Miura

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70318 2016年査読有り

2015

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

JOURNAL OF ELECTRONIC PACKAGING 137(3) 2015年9月査読有り

Quantitative evaluation of orbital hybridization in carbon nanotubes under radial deformation using pi-orbital axis vector

Masato Ohnishi, Ken Suzuki, Hideo Miura

AIP ADVANCES 5(4) 2015年4月査読有り

IMPROVEMENT OF THERMAL CONDUCTIVITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTIONS BY CONTROLLING THEIR MICRO TEXTURE

Pornvitoo Rittinon, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015年査読有り

IMPROVEMENT OF THERMAL CONDUCTIVITY OF ELECTROPLATED COPPER INTERCONNECTIONS BY CONTROLLING THEIR CRYSTALLINITY

Masaru Gotoh, Ken Suzuki, Hideo Miura

INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2 2015年査読有り

EFFECT OF THREE DIMENSIONAL STRAIN ON THE ELECTRONIC PROPERTIES OF GRAPHENE NANORIBBONS

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3 2015年査読有り

IMPROVEMENT OF THE LONG-TERM RELIABILITY OF INTERCONNECTION BY CONTROLLING THE CRYSTALLINITY OF GRAIN BOUNDARIES

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2 2015年査読有り

HIGHLY SENSITIVE TWO DIMENSIONAL TACTILE SENSOR USING MULTI-WALLED CARBON NANOTUBE

Takuya Nozaki, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015年査読有り

NANOTEXTURE CHANGE CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION DURING CREEP OF NI-BASE SUPERALLOY

Ken Suzuki, Motoyuki Ochi, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 9 2015年査読有り

IMPROVEMENT OF THE LONG-TERM RELIABILITY OF TSV INTERCONNECTIONS USED IN THREE-DIMENSIONAL STACKED MODULES

Hideo Miura, Ken Suzuki

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015年査読有り

CHANGE IN SPATIAL DISTRIBUTION OF STATE DENSITIES OF CARBON NANOTUBES UNDER ANISOTROPIC STRAIN FIELD

Masato Ohnishi, Yang Meng, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015年査読有り

HIGH CYCLE FATIGUE STRENGTH OF MODIFIED 9CR-1MO STEEL AT ELEVATED TEMPERATURES

Motoyuki Ochi, Ken Suzuki, Isamu Nonaka, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 9 2015年査読有り

Change in Electronic Properties of Carbon Nanotubes Caused by Local Distortion under Axial Compressive Strain

Ken Suzuki, Masato Ohnishi, Hideo Miura

2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 88-91 2015年査読有り

Thermal Stability of Electroplated Copper Thin-Film Interconnections

Pornvitoo Rittinon, Ken Suzuki, Hideo Miura

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015年査読有り

Variation of Thermal Stress in TSV Structures Caused by Crystallinity of Electroplated Copper Interconnections

Jiatong Liu, Ken Suzuki, Hideo Miura

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015年査読有り

THE EFFECT OF STRAIN ON THE ELECTRONIC PROPERTIES OF GRAPHENE NANORIBBONS

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015年査読有り

2014

Long-range topological correlations of real polycrystalline grains in two dimensions

Hao Wang, Guoquan Liu, Ying Chen, Arkapol Saengdeejing, Hideo Miura, Ken Suzuki

MATERIALS CHARACTERIZATION 97 178-182 2014年11月査読有り

Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures

Kota Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, Hideo Miura

International Journal of Materials and Structural Integrity 8(1-3) 21-31 2014年9月1日査読有り

Quality Control of Grain Boundaries in Copper Thin Films Used for 3D Interconnections

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 88-91 2014年査読有り

Micro Texture Control for Highly Reliable Copper Fine Bumps for 3D Integration

Masaru Gotoh, Ken Suzuki, Hideo Miura

2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 53-56 2014年査読有り

Improvement of the Crystallinity of Electroplated Copper Thin Films for Highly Reliable 3D Interconnections

Chuanhong Fan, Osamu Asai, Ryosuke Furuya, Ken Suzuki, Hideo Miura

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1885-1890 2014年査読有り

IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS

Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 2014年査読有り

EFFECT OF THE CRYSTALLINITY ON THE LONG-TERM RELIABILITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTIONS

Takeru Kato, Ken Suzuki, Hideo Miura

2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 359-362 2014年査読有り

HIGHLY SENSITIVE 2D STRAIN SENSOR USING CARBON NANOTUBE

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014年査読有り

EVALUATION OF THE CRYSTALLOGRAPHIC QUALITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTION EMBEDDED IN A SI SUBSTRATE

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014年査読有り

Spatial Distribution of State Densities Dominating Strain Sensitivity of Carbon Nanotubes

Masato Ohnishi, Ken Suzuki, Hideo Miura

2014 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD) 165-168 2014年査読有り

Quantitative Evaluation of the Quality of Grains and Grain Boundaries in Copper Thin Films used for 3D Interconnections

Takuya Murakoshi, Ken Suzuki, Hideo Miura

2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 69-72 2014年査読有り

EFFECT OF ANISOTROPIC STRAIN FIELD ON THE ELECTRONIC CONDUCTANCE OF CARBON NANOTUBES

Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 2014年査読有り

EFFECT OF ALLOYING ELEMENTS ON CREEP AND FATIGUE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION

Ken Suzuki, Tomohiro Sano, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 9 2014年査読有り

IMPROVEMENT OF THE RELIABILITY OF THIN-FILM INTERCONNECTIONS BASED ON THE CONTROL OF THE CRYSTALLINITY OF THE THIN FILMS

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014年査読有り

HIGHLY SENSITIVE 2D STRAIN SENSOR USING CARBON NANOTUBE

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73156) 1-6 2014年査読有り

IMPROVEMENT OF THE RELIABILITY OF THIN-FILM INTERCONNECTIONS BASED ON THE CONTROL OF THE CRYSTALLINITY OF THE THIN FILMS

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73149) 1-7 2014年査読有り

EFFECT OF THE LATTICE MISMATCH BETWEEN COPPER THIN-FILM INTERCONNECTION AND BASE MATERIAL ON THE CRYSTALLINITY OF THE INTERCONNECTION

Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73147) 1-6 2014年査読有り

EVALUATION OF THE CRYSTALLOGRAPHIC QUALITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTION EMBEDDED IN A SI SUBSTRATE

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73148) 1-7 2014年査読有り

EFFECT OF ALLOYING ELEMENTS ON CREEP AND FATIGUE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION

Ken Suzuki, Tomohiro Sano, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 9 (IMECE2013-64314) 1-6 2014年査読有り

EFFECT OF ANISOTROPIC STRAIN FIELD ON THE ELECTRONIC CONDUCTANCE OF CARBON NANOTUBES

Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 (IMECE2013-64487) 1-5 2014年査読有り

IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS

Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 (IMECE2013-65539) 1-6 2014年査読有り

2013

Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for Through-Silicon Vias

Ken Suzuki, Naokazu Murata, Naoki Saito, Ryosuke Furuya, Osamu Asai, Hideo Miura

JAPANESE JOURNAL OF APPLIED PHYSICS 52(4) 2013年4月査読有り

Change of the electronic conductivity of graphene nanoribbons and carbon nanotubes caused by a local deformation

Masato Ohnishi, Ken Suzuki, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 131-134 2013年査読有り

Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration

Ken Suzuki, Hideo Miura, Osamu Asai, Ryosuke Furuya, Jaeuk Sung, Naokazu Murata

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 264-267 2013年査読有り

MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING

Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 9, PTS A AND B 995-1000 2013年査読有り

Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films

Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura

Proceedings – Electronic Components and Technology Conference 635-640 2013年査読有り

2012

ANISOTROPIC STRAIN-FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES

Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 9, PTS A AND B 749-754 2013年査読有り

ANISOTROPIC STRAIN-FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES

Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 9, PTS A AND B IMECE2012-87347 749-754 2013年査読有り

MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING

Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 9, PTS A AND B IMECE2012-87342 995-1000 2013年査読有り

First-principles study on the dilute Si in bcc Fe: Electronic and elastic properties up to 12.5 at.%Si

Arkapol Saengdeejing, Ying Chen, Ken Suzuki, Hideo Miura, Tetsuo Mohri

Computational Materials Science 70 100-106 2013年査読有り

Effect of the Local Strain Distribution on the Electronic Conductivity of Carbon Nanotubes

Masato OHNISHI, Hiroshi KAWAKAMI, Ken SUZUKI, Hideo MIURA

Journal of Computational Science and Technology 7(2) 231-238 2013年査読有り

Influence of Oxygen Composition and Carbon Impurity on Electronic Reliability of HfO₂ Thin Films

Ken SUZUKI, Hideo MIURA

Journal of Computer Chemistry, Japan 12(1) 52-60 2013年査読有り

半導体実装用めっき銅薄膜強度物性の微細組織依存性

遠藤史明, 古屋亮輔, 鈴木研, 三浦英生

電子情報通信学会論文誌Ｃ J96-C(11) 400-408 2013年査読有り

The effect of chemical composition and heat treatment conditions on stacking fault energy for Fe-Cr-Ni austenitic stainless steel

Toshio Yonezawa, Ken Suzuki, Suguru Ooki, Atsushi Hashimoto

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 44(13) 5884-5896 2013年査読有り

2012

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

JOURNAL OF ELECTRONIC PACKAGING 134(2) 021006-1-021006-6 2012年6月査読有り

Change of the electronic conductivity of cnts and graphene sheets caused by a three-dimensional strain field

Masato Ohnishi, Ken Suzuki, Hideo Miura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 86-89 2012年

Stress-induced migration of electroplated copper thin film interconnections depending on thermal history

Ken Suzuki, Hideo Miura, Osamu Asai, Naoki Saito, Naokazu Murata

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 396-399 2012年

NANOSTRUCTURE DEPENDENCE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBES AND GRAPHENE SHEETS

Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 449-+ 2012年査読有り

MINIMIZATION OF THE LOCAL RESIDUAL STRESS IN 3D FLIP CHIP STRUCTURES BY OPTIMIZING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS AND THE ALIGNMENT STRUCTURE OF TSVS AND FINE BUMPS

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 19-25 2012年査読有り

In-line Monitoring of the Change of Residual Stress in Nano-Scale Transistors during Their Thin-Film Processing and Packaging

Hironori Tago, Ken Suzuki, Hideo Miura

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012年査読有り

Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 467-+ 2012年査読有り

STRESS-INDUCED AND ELECTRO-MIGRATION OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS USED FOR 3D INTEGRATION

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2 685-690 2012年査読有り

CHANGE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBE AND GRAPHENE SHEETS CAUSED BY A THREE-DIMENSIONAL STRAIN FIELD

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 457-462 2012年査読有り

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Naokazu Murata, Ken Suzuki, Hideo Miura

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012年査読有り

TWO-DIMENSIONAL STRAIN-DISTRIBUTION SENSOR USING CARBON NANOTUBE-DISPERSED RESIN

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 381-386 2012年査読有り

Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection

Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012年査読有り

NON-CONTACT AND REMOTE MEASUREMENT METHOD OF THE CHANGE OF THE ELECTRICAL CONDUCTIVITY OF CARBON NANOTUBES-DISPERSED RESIN UNDER STRAIN

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 703-708 2012年査読有り

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnections Embedded in TSV Structures

Ryosuke Furuya, Ken Suzuki, Hideo Miura

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012年査読有り

HIGH TEMPERATURE DAMAGES OF NI-BASE-SUPERALLOY CAUSED BY THE CHANGE OF NANOTEXTURE DUE TO STRAIN-INDUCED ANISOTROPIC DIFFUSION

Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION (IMECE 2010), VOL 9 73-79 2012年査読有り

HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS

Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 4, PTS A AND B 1649-1655 2012年査読有り

EFFECT OF CRYSTALLOGRAPHIC QUALITY OF GRAIN BOUNDARIES ON BOTH MECHANICAL AND ELECTRICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2 677-684 2012年査読有り

Highly Sensitive Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Ken Suzuki, Hideo Miura

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012年査読有り

Quantum Chemical Molecular Dynamics Study of Oxidation Process on Fe-Cr Alloy Surfaces in High Temperature Water

Ken Suzuki, Hideo Miura

NANOTECHNOLOGY 2012, VOL 2: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONAL 641-644 2012年査読有り

Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 IMECE2010-37279 467-+ 2012年査読有り

HIGH TEMPERATURE DAMAGES OF NI-BASE-SUPERALLOY CAUSED BY THE CHANGE OF NANOTEXTURE DUE TO STRAIN-INDUCED ANISOTROPIC DIFFUSION

Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION (IMECE 2010), VOL 9 IMECE2010-37284 73-79 2012年査読有り

NANOSTRUCTURE DEPENDENCE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBES AND GRAPHENE SHEETS

Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 IMECE2010-37277 449-+ 2012年査読有り

HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS

Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 4, PTS A AND B IMECE2011-62411 1649-1655 2012年査読有り

カーボンナノチューブ応用二次元ひずみ分布計測センサの試作

鈴木悠介, 大橋悠輔, 大西正人, 鈴木研, 三浦英生

日本機械学会論文集（A編） 78(789) 689-693 2012年査読有り

めっき銅薄膜配線ストレスマイグレーション支配因子の解明

齋藤直樹, 村田直一, 玉川欣治, 鈴木研, 三浦英生

電子情報通信学会論文誌C J95-C(11) 351-357 2012年査読有り

QUANTITATIVE EVALUATION OF THE CRYSTALLINITY OF GRAIN BOUNDARIES IN POLYCRYSTALLINE MATERIALS

Naokazu Murata, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 8 IMECE2012-87426 389-395 2012年査読有り

EFFECT OF DOPANT ELEMENT ON THE STRENGTH AND RELIABILITY OF NI-BASE SUPERALLOY AT HIGH TEMPERATURES

Tomohiro Sano, Ken Suzuki, Hideo Miura

INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION – 2012, VOL 8 IMECE2012-87341 215-220 2012年査読有り

Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections

Naoki Saito, Naoakzu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1153-1158 2012年査読有り

2011

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Proceedings of ASME InterPACK2011 IPACK2011-52048 1-8 2011年7月6日査読有り

Ionic Conductivity in Uniaxial Micro Strain/Stress Fields of Yttria-Stabilized Zirconia

Kazuhisa Sato, Ken Suzuki, Ryo Narumi, Keiji Yashiro, Toshiyuki Hashida, Junichiro Mizusaki

JAPANESE JOURNAL OF APPLIED PHYSICS 50(5) 055803-1-055803-5 2011年5月査読有り

Stress-induced Migration of the Electroplated Copper Thin Film Interconnection

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

International Conference on Electronics Packaging 871-874 2011年4月13日査読有り

Monitoring Method of Residual Stress in a Substrate During Thin Film Processing

Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura

International Conference on Electronics Packaging 853-856 2011年4月13日査読有り

カーボンナノチューブ電気伝導特性に及ぼすひずみの影響

鈴木悠介, 大西正人, 鈴木研, 三浦英生

日本機械学会論文集 A編 77(777) 769-773 2011年

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年査読有り

Evaluation of the change of the residual stress in nano-scale transistors during the deposition and fine patterning processes of thin films

Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura, Masaki Yoshimaru, Ken-Ichiro Tatsuuma

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 1-6 2011年査読有り

Mechanical and electrical reliability of copper interconnections for 3DIC

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 154-159 2011年査読有り

Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura

2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2119-2125 2011年査読有り

Minimization of the local residual stress in 3D flip chip structures by optimizing the mechanical properties of electroplated materials and the alignment structure of TSVs and fine bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 19-25 2011年査読有り

Two-dimensional strain-distribution sensor using carbon nanotube-dispersed resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 381-386 2011年査読有り

Change of the electronic conductivity of carbon nanotube and graphene sheets caused by a three-dimensional strain field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 457-462 2011年査読有り

Non-contact and remote measurement method of the change of the electrical conductivity of carbon nanotubes-dispersed resin under strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 703-708 2011年査読有り

MEASUREMENT OF THE LOCAL RESIDUAL STRESS BETWEEN FINE METALLIC BUMPS IN 3D FLIP CHIP STRUCTURES

Kohta Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, Hideo Miura

12th International Conference on Electronics Materials and Packaging 137-142 2010年10月25日査読有

REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER

Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, Hideo Miura

12th International Conference on Electronics Materials and Packaging 131-136 2010年10月25日査読有り

NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS

Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura

12th International Conference on Electronics Materials and Packaging 117-123 2010年10月25日査読有り

Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both Mechanical and Electrical Properties of the Jointed Structures

Seongcheol Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura

Transactions of The Japan Institute of Electronics Packaging 2(1) 91-97 2010年4月23日査読有り

Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors

Ken Suzuki, Yoichi Takeda, Hideo Miura

Journal of Solid Mechanics and Materials Engineering 4(11) 1644-1653 2010年4月1日査読有り

Quantum chemical molecular dynamics simulation of oxidation process on clean metal surface in high temperature water

Ken Suzuki, Hideo Miura

Materials Research Society Symposium Proceedings 1263 25-30 2010年

Mechanical and electrical properties of electroplated copper thin films used for thin film interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Materials Research Society Symposium Proceedings 1249 271-276 2010年

J0601-3-2 エリアアレイ型フリップチップ実装局所残留応力のアンダーフィル材質依存性([J0601-3]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

中平航太, 村田直一, 鈴木研, 三浦英生

年次大会講演論文集 2010 265-266 2010年

J0601-3-1 めっき銅薄膜配線の強度信頼性に及ぼす微細組織の影響([J0601-3]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

村田直一, 斉藤直木, 鈴木研, 三浦英生, TAMAKAWA Kinji

年次大会講演論文集 2010 263-264 2010年

Remote non-contact strain sensor using carbon nanotube-dispersed resin

Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings 2010年査読有り

REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE-DISPERSED RESIN

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 569-574 2010年査読有り

MICRO TEXTURE DEPENDENCE OF MECHANICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILMS USED FOR THIN FILM INTERCONNECTION

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 353-359 2010年査読有り

IN-LINE EVALUTION METHOD OF THE INTRINSIC STRESS OF THIN FILMS USED FOR TRANSISTOR STRUCTURES

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 239-245 2010年査読有り

REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE-DISPERSED RESIN

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 569-574 2010年査読有り

IN-LINE EVALUTION METHOD OF THE INTRINSIC STRESS OF THIN FILMS USED FOR TRANSISTOR STRUCTURES

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 239-245 2010年査読有り

Creep and fatigue damages of Ni-base- superalloy caused by strain-induced anisotropic diffusion of component elements

Hideo Miura, Ken Suzuki, Hiroyuki Ito, Tatsuya Inoue

ADVANCES IN FRACTURE AND DAMAGE MECHANICS VIII 417-418 261-+ 2010年査読有り

Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures

Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura

Proc. of ICEP 2010 345-348 2010年査読有り

MICRO TEXTURE DEPENDENCE OF MECHANICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILMS USED FOR THIN FILM INTERCONNECTION

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 353-359 2010年査読有り

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 1-6 2010年査読有り

Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures

Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1951-1956 2010年査読有り

Improvement of the Interface Integrity between a High-k Dielectric Film and a Metal Gate Electrode by Controlling Point Defects and Residual Stress

Ken Suzuki, Tatsuya Inoue, Hideo Miura

SISPAD 2010 – 15TH INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 213-216 2010年査読有り

Stress-induced migration of electroplated copper thin films used for 3D integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings IPACK2011-52058 1-6 2010年査読有り

微細バンプ接合部の信頼性に及ぼす銅スズ金属間化合物の影響

鄭聖哲, 村田直一, 佐藤祐規, 鈴木研, 三浦英生

材料 58(10) 827-832 2009年10月査読有り

Quantum Chemical Molecular Dynamics Study of Degradation Mechanism of Interface Integrity between a HfO₂ Thin Film and a Metal Gate Electrode

Tatusya Inoue, Ken Suzuki, Hideo Miura

Proceedings of International Conference on Simulation of Semiconductor Processes and Devices, 2009 198-201 2009年9月査読有り

Effect of Y2O3 addition on the conductivity and elastic modulus of (CeO2)(1-x)(YO1.5)(x)

Kazuhisa Sato, Ken Suzuki, Keiji Yashiro, Tatsuya Kawada, Hiroo Yugami, Toshiyuki Hashida, Alan Atkinson, Junichiro Mizusaki

SOLID STATE IONICS 180(20-22) 1220-1225 2009年8月査読有り

Early stage SCC initiation analysis of fcc Fe-Cr-Ni ternary alloy at 288 °C: A quantum chemical molecular dynamics approach

Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji

Corrosion Science 51(4) 908-913 2009年4月査読有り

Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope

Hideo Miura, Kuniaki Akahoshi, Ken Suzuki

NDT & E INTERNATIONAL 42(3) 188-192 2009年4月査読有り

Early stage SCC initiation analysis of fcc Fe-Cr-Ni ternary alloy at 288℃ : A quantum chemical molecular dynamics approach

Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji

Corrosion Science 51(4) 908-913 2009年4月査読有り

Fatigue Strength of Electroplated Copper Thin Films under Uni-Axial Stress

Naokazu MURATA, Kinji TAMAKAWA, Ken SUZUKI, Hideo MIURA

Journal of Solid Mechanics and Materials Engineering 3 498-506 2009年3月査読有り

Creep Damage Process of Ni-Base Superalloy Caused by Stress-Induced Anisotropic Atomic Diffusion

Ken SUZUKI, Hiroyuki ITO, Tatsuya INOUE, Hideo MIURA

Journal of Solid Mechanics and Materials Engineering 3(3) 487-497 2009年3月査読有り

Density functional study of atomic oxygen and water molecule adsorption on chromium substituted Ni surface

N. K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji

Molecular Simulation 2009年査読有り

Conductivity variation of yttria-stabilized zirconia under stress

T. Izumi, R. Narumi, K. Sato, K. Suzuki, K. Yashiro, T. Hashida, J. Mizusaki

ECS Transactions 16 125-132 2009年査読有り

Quantum Chemical Molecular Dynamics Study of Degradation Mechanism of Interface Integrity between a HfO(2) Thin Film and a Metal Gate Electrode

Tatsuya Inoue, Ken Suzuki, Hideo Miura

2009 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 198-201 2009年査読有り

MULTI-SCALE MEASUREMENT OF THE CHANGE OF THE RESIDUAL STRESS IN A SILICON CHIP DURING MANUFACTURING FROM THIN-FILM PROCESSING TO PACKAGING

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura

IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE 259-262 2009年査読有り

Effect of Micro-Texture of Electroplated Copper Thin-Films on Their Mechanical and Electrical Reliability

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE 385-388 2009年査読有り

Quantum chemical molecular dynamics study of strain effect on the oxygen diffusion in fcc Fe (111) and Fe-Cr (111) surfaces at 288 ℃

N. K. Das, T. Shoji, K. Suzuki, Y. Takeda

12th International Conference on Fracture, Ottawa, Canada 8 6061-6068 2009年査読有り

Microtexture Dependence of Mechanical Properties of Electroplated Copper Thin films Used for Thin Film Interconnections

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

ASME Proc. of InterPACK 2009,(IPACK2009-89079) 2009年査読有り

Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both Mechanical and Electrical Properties of the Jointed Structures

Seongcheol Jeong, Ken Suzuki, Hideo Miura

International Conference on Electronic Packaging, (15B2) 2(1) 91-97 2009年査読有り招待有り

DEGRADATION OF INTERFACE INTEGRITY BETWEEN A HIGH-K DIELECTRIC THIN FILM AND A GATE ELECTRODE DUE TO EXCESS OXYGEN IN THE FILM

Hideo Miura, Ken Suzuki, Yuta Ito, Seiji Samukawa, Tomonori Kubota, Toru Ikoma, Hideki Yoshikawa, Shigenori Ueda, Yoshiyuki Yamashita, Keisuke Kobayashi

2009 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, VOLS 1 AND 2 376-+ 2009年査読有り

Strain Dependence of Dielectric Properties and Reliability of High-k Thin Films

K. Suzuki, K. Imasaki, Y. Ito, H. Miura

2009 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 59-62 2009年査読有り

Quantum chemical molecular dynamics study of strain effect on metal and oxide interface interaction at high temperature

N.K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji

EUROCORR 2008, September 7-11 2008, Edinburgh, Scotland (1226) 2008年9月

Effect of interface characteristics of W/HfO₂ on electronic reliability : Quantum chemical molecular dynamics study

Ken Suzuki, Tatsuya Inoue, Hideo Miura

Proceedings of 2008 International Conference on Simulation of Semiconductor Processes and Devices 357-360 2008年9月査読有り

Quantum chemical molecular dynamics study of stress corrosion cracking behavior for fcc Fe and Fe-Cr surfaces

Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji

Corrosion Science 50(6) 1701-1706 2008年6月査読有り

1213 Ni耐熱合金の高温強度特性に及ぼす微量添加元素の影響(S05-3 ナノ・マイクロ材料の強度・信頼性(3)ナノ・マイクロ材料の強度物性評価,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

井上達也, 鈴木研, 三浦英生

年次大会講演論文集 2008 167-168 2008年

1212 圧縮ひずみ負荷による多層CNTの変形挙動解析(S05-3 ナノ・マイクロ材料の強度・信頼性(3)ナノ・マイクロ材料の強度物性評価,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

大崎克也, 鈴木研, 三浦英生

年次大会講演論文集 2008 165-166 2008年

1201 めっき銅薄膜の疲労強度特性の熱履歴依存性(S05-1 ナノ・マイクロ材料の強度・信頼性(1)銅薄膜の強度物性,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

村田直一, 玉川欣治, 鈴木研, 三浦英生

年次大会講演論文集 2008 143-144 2008年

Fatigue strength of electroplated copper thin films under uni-axial stress

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

2008 EMAP CONFERENCE PROCEEDINGS 41-44 2008年査読有り

Effect of Interface Characteristics of W/HfO2 +/- x on Electronic Reliability: Quantum Chemical Molecular Dynamics Study

Ken Suzuki, Tatsuya Inoue, Hideo Miura

SISPAD: 2008 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 357-360 2008年査読有り

Fe(111) AND Fe-Cr(111) SURFACE H₂O INTERACTION AT DIFFERENT TEMPERATURES BY QUANTUM CHEMICAL MOLECULAR DYNAMICS

Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji

Proceedings of JSCE Materials and Environments 2008 A302 105-108 2008年査読有り

Stress corrosion cracking analysis of Fe (111) and Fe-Cr (111) surface at different temperatures by quantum chemical molecular dynamics

N. K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji

16th Pacific Basin Nuclear Conference P16P1100 2008年査読有り

Theoretical design of SCC resistant Ni-base alloy by a computational chemistry approach

Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji

International Conference on Advances in Nuclear Power Plants, ICAPP 2008 4 2175-2182 2008年査読有り

Multiscale modeling approach to stress corrosion cracking

Ismail Tirtom, Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji

International Conference on Advances in Nuclear Power Plants, ICAPP 2008 4 2081-2089 2008年査読有り

Degradation of reliability of high-k gate dielectrics caused by point defects and residual stress

Hideo Miura, Ken Suzuki, Toru Ikoma, Seiji Samukawa, Hideki Yoshikawa, Shigenori Ueda, Yoshiyuki Yamashita, Keisuke Kobayashi

2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS – 46TH ANNUAL 713-+ 2008年査読有り

1923 光伝送システム用レーザチップの機械的信頼性評価(J16-3 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(3),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

北村篤史, 鈴木研, 三浦英生

年次大会講演論文集 2007 211-212 2007年

2425 応力依存異方拡散現象による耐熱合金劣化損傷機構の検討(S13-3 高温材料・構造の強度と破壊(3),S13 高温材料・構造の強度と破壊)

伊藤大幸, 鈴木研, 三浦英生

年次大会講演論文集 2007 423-424 2007年

Effect of packaging stress in a laser chip on its radiation spectrum

Atsushi Kitamura, Ken Suzuki, Hideo Miura

IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 687-692 2007年査読有り

Quantum chemical molecular dynamics analysis of the effect of oxygen vacancies and strain on dielectric characteristic of HfO2-x films

Y. Ito, K. Suzuki, H. Mura

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 150-153 2007年査読有り招待有り

Fluctuation mechanism of mechanical properties of electroplated-copper thin films used for three dimensional electronic modules

Hideo Miura, Ken Suzuki, Kinji Tamakawa

EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS 177-+ 2007年査読有り

Degradation mechanism of dielectric properties of HfO2-x due to interaction of oxygen composition and strain

K. Suzuki, Y. Ito, H. Ito, H. Miura

2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS 42-+ 2007年査読有り招待有り

Micro texture-induced variation of mechanical properties of electroplated copper thin films

Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura

IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 735-741 2007年査読有り

Influence of oxygen composition and carbon impurity on electronic reliability of HfO2

K. Suzuki, Y. Ito, H. Miura

SISPAD 2007: SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 2007 165-168 2007年査読有り

Influence of intrinsic defects and strain on electronic reliability of gate oxide films

Ken Suzuki, Yuta Ito, Hideo Miura

Materials Research Society Symposium Proceedings 917 82-87 2006年

P55 応力依存異方性拡散現象によるNi基超合金微細分散組織の変化挙動解析(OS13)

伊藤大幸, 鈴木研, 三浦英生

材料力学部門講演会講演論文集 2006 629-630 2006年

P78 カーボンナノチューブ分散樹脂を用いた非破壊ひずみ計測技術の基礎検討(GS5)

冨士英輝, 鈴木研, 三浦英生

材料力学部門講演会講演論文集 2006 669-670 2006年

P12 薄膜光導波路内の光伝播特性に及ぼす薄膜残留応力の影響(OS2)

北村篤史, 鈴木研, 三浦英生

材料力学部門講演会講演論文集 2006 543-544 2006年

3961 分子動力学解析に基づくステンレス鋼の応力腐食割れ機構研究(S21-4 微細構造体の設計と解析,S21 ナノ・マイクロ構造体の強度物性と信頼性)

鈴木研, 伊藤大幸, 三浦英生

年次大会講演論文集 2006 917-918 2006年

高温環境下におけるセリア系セラミックスの破壊特性に関する研究

佐藤一永, 鈴木研, 橋田俊之, 水崎純一郎

2004年度傾斜機能材料論文集（FGM2004） 139-143 2005年3月査読有り

1816 量子分子動力学による応力起因拡散現象の基礎検討(J06-3 マイクロ・ナノ構造解析法と応用,J06 計算マイクロ・ナノメカニクス)

伊藤大幸, 鈴木研, 三浦英生

年次大会講演論文集 2005 229-230 2005年

1815 高誘電率薄膜材料のバンドギャップに及ぼす結晶欠陥と格子ひずみの影響(J06-3 マイクロ・ナノ構造解析法と応用,J06 計算マイクロ・ナノメカニクス)

伊藤雄太, 鈴木研, 三浦英生

年次大会講演論文集 2005 227-228 2005年

(CeO2) 1-x (YO1.5) xの合成と弾性特性の評価に関する研究

佐藤一永, 橋田俊之, 鈴木研, 湯上浩雄, 川田達也, 水崎純一郎

粉体および粉末冶金 52(11) 840-844 2005年査読有り

Influence of oxygen vacancies and strain on electronic reliability of SiO2-x films

K Suzuki, Y Ito, H Miura, T Shoji

Semiconductor Defect Engineering-Materials, Synthetic Structures and Devices 864 77-82 2005年査読有り

Quantum chemical molecular dynamics analysis of the effect of intrinsic defects and strain on dielectric characteristic of gate oxide films

K Suzuki, Y Ito, H Miura

SISPAD: 2005 International Conference on Simulation of Semiconductor Processes and Devices 327-330 2005年査読有り

Electronic structure of the electrode/electrolyte interface: large-scale tight-binding quantum chemical simulation

Y Makino, T Kusagaya, K Suzuki, A Endou, M Kubo, P Selvam, H Ota, F Yonekawa, N Yamazaki, A Miyamoto

SOLID STATE IONICS 175(1-4) 847-850 2004年11月査読有り

Computational Chemistry Study of Accelerated Oxidation Mechanism of IGSCC of Structural Materials in LWR Environments and Theoretical Design of SCC Resistant Alloys

K. Suzuki, Y. Takeda, Z. Lu, T. Shoji

Proceeding of International Congress on Advances in Nuclear Power Plants 2004年査読有り

Monte Carlo simulation of hydrogen absorption in palladium and palladium–silver alloys

H. Kurokawa, T. Nakayama, Y. Kobayashi, K. Suzuki, M. Takahashi, S. Takami, M. Kubo, N. Itoh, P. S.elvam, A. Miyamoto

Catalysis Today 82(1-4) 233-240 2003年7月査読有り

Materials design of perovskite-based oxygen ion conductor by molecular dynamics method

Y Yamamura, C Ihara, S Kawasaki, H Sakai, K Suzuki, S Takami, M Kubo, A Miyamoto

SOLID STATE IONICS 160(1-2) 93-101 2003年5月査読有り

Computational chemistry study on the dynamics of lubricant molecules under shear conditions

D Kamei, H Zhou, K Suzuki, K Konno, S Takami, M Kubo, A Miyamoto

TRIBOLOGY INTERNATIONAL 36(4-6) 297-303 2003年4月査読有り

高速化量子分子動力学法による電極・電解液界面反応の検討

牧野裕介, 草谷友規, 鈴木研, 遠藤明, 久保百司, 今村詮, 太田洋邦, 米川文広, 山崎信幸, 宮本明

化学工学会研究発表講演要旨集 2003 65-65 2003年

Tight-binding quantum chemical molecular dynamics study of cathode materials for lithium secondary battery

K Suzuki, Y Kuroiwa, S Takami, M Kubo, A Miyamoto, A Imamura

SOLID STATE IONICS 152 273-277 2002年12月査読有り

Development and application of nonequilibrium simulation program for ion diffusion in battery

CH Jung, H Morito, Y Kobayashi, K Suzuki, S Takami, M Kubo, A Miyamoto

SOLID STATE IONICS 152 279-284 2002年12月査読有り

Combinatorial computational chemistry approach to the design of cathode materials for a lithium secondary battery

K Suzuki, Y Kuroiwa, S Takami, M Kubo, A Miyamoto

APPLIED SURFACE SCIENCE 189(3-4) 313-318 2002年4月査読有り

The fate of a cluster colliding onto a substrate – Dissipation of translational kinetic energy

S Takami, K Suzuki, M Kubo, A Miyamoto

JOURNAL OF NANOPARTICLE RESEARCH 3(2-3) 213-218 2001年6月査読有り

Atomistic Crystal Growth Simulation of Metal Oxide Materials

M. Kubo, H. Kurokawa, Y. Inaba, K. Suzuki, S. Takami, A. Miyamoto, M. Kawasaki, M. Yoshimoto, H. Koinuma

Transactions of the Materials Research Society of Japan 26 989-992 2001年査読有り

計算化学によるSiO₂―Auクラスター間の相互作用の解明

高見誠一, 谷島健二, 鈴木研, 遠藤明, 久保百司, 宮本明

化学工学論文集 26(6) 770-775 2000年11月査読有り

Structural properties of LixMn2O4 as investigated by molecular dynamics and density functional theory

K Suzuki, Y Oumi, S Takami, M Kubo, A Miyamoto, M Kikuchi, N Yamazaki, M Mita

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 39(7B) 4318-4322 2000年7月査読有り

Molecular dynamics simulations of adhesional forces via hydrocarbon films

H Tamura, Z Hui, Y Inaba, K Suzuki, S Takami, M Kubo, A Miyamoto

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 39(7B) 4425-4426 2000年7月査読有り

Molecular dynamics simulation of enhanced oxygen ion diffusion in strained yttria-stabilized zirconia

K Suzuki, M Kubo, Y Oumi, R Miura, H Takaba, A Fahmi, A Chatterjee, K Teraishi, A Miyamoto

APPLIED PHYSICS LETTERS 73(11) 1502-1504 1998年9月査読有り

Molecular dynamics simulations on oxygen ion diffusion in strained YSZ/CeO(2) superlattice

K Suzuki, A Endou, R Miura, Y Oumi, H Takaba, M Kubo, A Chatterjee, A Fahmi, A Miyamoto

APPLIED SURFACE SCIENCE 130 545-548 1998年6月査読有り